EMSNOW prowled the exhibitions at SMTA International today, and here’s some of what we saw. This year’s conference features dedicated tracks in:
- Advanced Packaging (APT): First-level packaging, new assembly techniques, and integration methods for increasingly complex devices.
- Additively Manufactured Electronics (AME): Emerging processes, materials, and design strategies that open the door to new possibilities.
- Low Temperature Solder (LTS): Innovations enabling reliable reflow soldering at lower temperatures, protecting components and cutting energy use.
- Manufacturing for Excellence (MFX): Practical solutions for today’s most pressing process challenges across the production floor.
- Reliability and Harsh Environments (RHE): Testing and materials research to ensure devices perform where failure is not an option.
- Test and Inspection (INS): The latest advancements in ensuring short- and long-term product reliability.
Beyond the sessions, the exhibition floor connects attendees with leading solution providers and suppliers who are actively building the future. One fun event bringing people together was the Bright Manufacturing Robotic Challenge. The culminating event involved student-designed and assembled robots competing in a real-world mission on a custom-built arena floor. The round taking place on Wednesday evaluates the integration of electronics, firmware, mechanical design, and teamwork under pressure. It demonstrates how effectively teams turned their PCB design into a functional, mission-capable robot.
In Round Four, student teams bring their completed robots to life in a real-world competition on a physical arena floor. Each robot must autonomously or semi-autonomously complete tasks within a defined mission scenario, simulating a real engineering challenge such as package delivery, search and rescue, or terrain navigation. This fun event even has a $2,500 cash prize!
This culture of collaboration and openness is where real breakthroughs happen. A conversation in a session room or over coffee might spark the next innovation in packaging or inspire a new approach to reliability testing. These are the kinds of exchanges that no paper or webinar alone can replicate.
With more than 500 companies on the show floor, attendees see state-of-the-art equipment, materials, and processes in action. From soldering and inspection systems to advanced packaging and additive electronics, the exhibition brings breakthrough technologies directly to you.
EMSNOW met with Koh Young Technology, an industry-leader in True 3D measurement-based inspection solutions and the Gold Sponsor of SMTA International, demonstrated its award-winning inspection solutions in Booth 2817. We discussed industry trends and upcoming Koh Young case studies with Brent A. Fischthal, Head of Global Marketing Communications. These solutions were in focus:
Automated Optical Inspection (AOI)
The Zenith 2 AOI delivers industry-leading inspection performance with True 3D measurement-based technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology. We did not start with antiquated 2D technology and its inherent shortcomings. We did not simply add some 3D tech to a legacy 2D system. At Koh Young, our AOI systems measure in True 3D from the start. We find the component body based on true 3D profilometric information. Using this approach, we deliver trustworthy inspection results, regardless of substrate color, board warpage, or component variations. When our 3Dmeasurement data meets our AI engines, we can deliver even more benefits to manufacturers.
Dispense Process Inspection (DPI)
The award-winning Neptune C+ is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and 
inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent materials.
Process Control
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. In short, the award-winning KSMART software suite seamlessly turns manufacturing data into production insights to help manufacturers improve the process.
Print Process Optimization
The Koh Young Process Optimizer (KPO) solution is an AI-based automatic print process optimizer. This system improves the printer offset, as well as critical printer parameters like squeegee speed, print pressure, and separation speed. KPO performs an automated DOE to determine the optimum printing parameters for the best print quality. As a result, manufacturers can optimize the print process, without the need for a dedicated print process expert. Furthermore, KPO monitors and perfects parameters in real-time to guarantee quality despite environmental changes.
We also stopped by the Indium Corporation booth to discuss solder with Kevin Brennan, Sr. Product Development Specialist. Durafuse® LT is a low-temperature solder with some special properties, which Kevin is happy to discuss with great enthusiasm.
Durafuse® LT is a solder paste alloy system engineered to decrease peak reflow temperature without compromising performance, he explained. It can reduce energy usage, improve reliability, and enable step soldering. It is ideal for assemblies with large temperature gradients and components prone to complex warpage during reflow. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 under optimal process conditions.
Other products showcased include:
Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling capabilities (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- CW-818 is a halide-free, no-clean cored wire with spatter control technology that provides fast wetting speeds to minimize cycle times in manual and robotic soldering processes.
To learn more about Indium Corporation’s high-reliability solutions, visit the company’s experts at SMTAI in booth 2842.
