Shrinking Tech, Expanding Possibilities – The Miniaturisation Trend in PCB Assembly
By Andrew Hutchison, Engineer, Dynamic EMS
One trend that has been gaining traction in recent years is the trend towards miniaturisation in Printed Circuit Board Assembly (PCBA) Miniaturisation is driven by several factors, including the increasing demand for smaller and more compact electronic devices, the need for greater portability, and the desire for more energy-efficient products. To meet these demands, PCBAs are being designed to be smaller and more densely packed than ever before
This trend towards miniaturisation presents several challenges for manufacturers. One of the biggest challenges is the need to maintain high levels of performance and reliability in the face of shrinking board sizes. As PCBAs become smaller and more densely packed, it becomes increasingly difficult to ensure that all the components are properly placed and that the board functions as intended.
To address this challenge, manufacturers are developing new techniques and technologies to enable miniaturisation. One approach is to use high-density interconnects (HDIs), which allow for a greater number of connections to be made in a smaller space. HDIs are made possible by advances in microvia technology, which allows for the creation of smaller and more precise vias.
Another approach is to use advanced Surface Mount Technology (SMT), which enables the placement of smaller and more complex components. SMT involves the use of automated equipment to place components directly onto the surface of the PCB, rather than inserting them through holes. This technique enables manufacturers to place components closer together and create smaller, more compact PCBAs.
Despite the challenges associated with miniaturisation, there are also several benefits. Smaller PCBAs require less material and energy to manufacture, which can lead to cost savings and reduced environmental impact. In addition, smaller devices are more portable and can be used in a wider range of applications, from wearables and medical devices to aerospace and defense applications.
At Dynamic EMS, we are committed to staying ahead of the trends and meeting the evolving needs of our customers. To that end, we are investing in the latest technologies and techniques to enable miniaturisation in PCBAs. For example, we have recently invested in new pick-and-place equipment that enables us to place components with greater accuracy and speed, even in small and densely packed PCBAs.
We are also working closely with our customers to understand their specific needs and requirements when it comes to miniaturisation. By partnering with our customers from the early design stage through to production, we can help to ensure that their products are optimised for performance, reliability, and cost-effectiveness.
Miniaturisation is a trend that is shaping the future of Printed Circuit Board Assembly (PCBA). While it presents a number of challenges, it also offers a range of benefits, from cost savings to greater portability and versatility. At Dynamic EMS, we are committed to staying at the forefront of this trend and helping our customers to leverage the latest technologies and techniques to create the best possible products. If you’d like to discuss miniaturisation with our team of expert engineers, please don’t hesitate to get in content. We are here to make electronics manufacturing easy and dynamic.