SEMI 3D & Systems Summit and NextGen Talent Opens to Spotlight Heterogeneous Integration for Europe’s Semiconductor Resilience

DRESDEN, Germany  — More than 150 global experts are set to convene in Dresden from June 25–27 for the SEMI 3D & Systems Summit 2025 to explore the latest breakthroughs in 3D packaging and heterogeneous integration. Registration is open.

Themed Heterogeneous Integration: Bolstering Europe’s Resilience, the summit will explore innovations in chiplet architectures, die-to-wafer and wafer-to-wafer hybrid bonding, photonics, and advanced system-level design. From geopolitical dynamics and advanced packaging breakthroughs to high-performance computing and biomedical applications, the program will offer insights into how 3D and heterogeneous integration technologies are reshaping Europe’s semiconductor value chain.

“The SEMI 3D & Systems Summit opens here in Dresden tomorrow to welcome industry leaders, technology innovators, and future talent to exchange ideas and advance collaboration on technologies critical to Europe’s semiconductor future,” said Laith Altimime, President of SEMI Europe. “This year’s focus on heterogeneous integration reflects our shared commitment to strengthening Europe’s resilience and global competitiveness through innovation, and to investing in the next generation of semiconductor professionals who will drive this transformation.”

A key highlight of this year’s Summit is the NextGen Talent session, designed to connect students and young professionals with industry leaders as Europe works to build a strong pipeline of semiconductor talent. This dedicated session will explore how collaboration between academia and industry can help close critical skill gaps and foster innovation. Program highlights include A Day in the Life talks, providing students with first-hand insights into semiconductor careers, and the panel discussion What Fab Managers Want: Talent, Workforce, and HR Perspectives. Additional activities, including a Student Quiz and Flash Mentoring session, will offer valuable opportunities for emerging talent to engage with experienced professionals and explore meaningful career pathways within the industry.

Participating Mentors

• Laith Altimime, President, SEMI Europe
• Bernard Capraro, Senior Manager, University Partnerships & Talent Initiative, SEMI Europe
• Sibo Chen, Sales Account Manager, KLA
• Dirk Drescher, Plant Manager, Robert Bosch Semiconductor Manufacturing Dresden
• Cassandra Melvin, Senior Director, Business Development and Operations, SEMI Europe
• Michael Schaub, Talent Acquisition Manager, Comet
• Daria Schüpbach, Head of Global Talent Acquisition, Comet
• Anne-Mary Yeboah, Technology Manager, SOITEC

Featured Speakers 

• Christian Koitzsch, President & Managing Director, European Semiconductor Manufacturing Company (ESMC)
• Dave Thomas, Vice President, Product Management, SPTS Technologies, KLA
• Dirk Drescher, Plant Manager, Robert Bosch Semiconductor Manufacturing Dresden
• Isabella Drolz, Vice President, Marketing & Product Strategy, Comet
• Jan Vardaman, President, TechSearch International
• Jekaterina Viktorova, Founder & CEO, Syenta
• Lode Lauwers, Senior Vice President of Business Development and Strategy, imec
• Peter Jenkins, President & CEO, Infinitesima
• Seung Kang, Senior Vice President, Semiconductor Strategy, Adeia
• Sébastien Dauvé, CEO, CEA-Leti
• Stephan Guttowski, Managing Director, Fraunhofer Group for Microelectronics
• Thomas Kralinski, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate

Global Leaders to Present  

3D & Systems Summit presenters include experts from global leaders: