RUSH PCB Announces Ten-Layer High Density Interconnect Board Design Capability
San Jose, California, U.S.A. – Rush PCB Inc., a printed circuit design, fabrication and assembly company located in the heart of Silicon Valley, offers capabilities in the design and manufacturing of multilayer High-Density Interconnect (HDI) PCBs of 10 layers and more.
In making the announcement, Akber Roy, CEO, stated, “To achieve very high-density interconnection, designers at Rush PCB Inc. use what we know as “Every Layer Interconnect” (ELIC) technology. This is a method wherein each layer has its own copper-filled laser-drilled micro-vias. When stacked up, it provides the opportunity for dynamic connections between any two layers in the PCB. Not only does this offer an increased level of flexibility, but it also maximizes circuit density.” Roy adds that RUSH designers have taken up the additional complex challenges in routing with Via-In-Pad (VIP) and by employing blind and buried vias. They laser-drill via holes and filled them with conductive copper paste.
Roy adds that “Before finalizing the design of multi-layer PCBs, our designers confirm the structure of the circuit board primarily based on the scale, physical size, and the requirements of electromagnetic compatibility (EMC). Our designers use 10 layers of material, and in this ‘Stack-Up Design’ have decided that the placement of the inner layer and the manner of distribution of different signals in these layers of the multi-layer PCB. This careful planning and determination of the stack-up design beforehand save the user much time and effort in wiring and production later.”
“Apart from very fine traces in the foil pattern, HDI requires Sequential Build-Up (SBU) and micro-vias drilled with lasers,” Roy says. “SBU technology is used to fabricate HDI boards. The HDI layers are usually built up from a traditionally manufactured double-sided core board or multilayer PCBs.”