Productronica 2025: The Industry Gathers in Munich to Learn and Network

Arguably, the world’s leading trade fair for the development and production of electronics, productronica 2025 celebrates its 50th anniversary. From November 18 to 21, Munich is once again the meeting place for the international electronics industry. productronica 2025 will focus on advanced packaging, power electronics and trusted microelectronics. As in previous years, SEMICON Europa will be co-located with productronica at the Messe München exhibition center. The conceptual sponsor of productronica is the industry association VDMA Productronic.

For its 50th anniversary, productronica can look forward to well-booked exhibition halls. Over 1,600 companies from more than 50 countries will present solutions and products for the future of electronics manufacturing. Alongside productronica, which will occupy seven halls and a total area of 80,000 m², SEMICON Europa, taking place at the same time, will focus on innovations and trends in the field of semiconductors, spread over an area of 25,000 m² and three halls.

The exhibition is organized around six key areas:

PCB and EMS -Since the launch of the PCB & EMS Marketplace in 2011, productronica has offered a unique forum for the entire PCB and EMS industry – an ideal meeting place for anyone interested in the entire spectrum of PCB and printed circuit board manufacturing or looking for the optimal system solution from a service provider for electronic manufacturing services.

SMT Assembly – From component-mount technology, soldering and joining technology for PCBs, test and measurement, quality assurance and product finishing to production subsystems as well as production logistics and material-flow technology.

Cables, Coils, and Hybrids – More and more things are becoming wireless, and yet this industry would be unimaginable without technologies from the companies in the Cables, Coils and Hybrids cluster.

Semiconductor manufacturing – The manufacture of semiconductors is a focal point of the trade fair. Visitors can gain insights about the current trends surrounding materials, packaging technologies and manufacturing processes.

Future Trends in Manufacturing – Industry 4.0, the Smart Factory, 3D printing in electronics manufacturing: Things that sounded like science fiction a few years ago are now technically feasible and offer unlimited potential for the widest variety of applications. But what will actually prevail, and what will remain little more than an empty theory?

Overall Production Support – It starts with metalic and non-metallic preliminary products and semi-finished goods and covers everything from operating equipment and supplies to comprehensive production facilities. Add to that a variety of complex decontamination, cleaning and disposal solutions. At productronica, environmental management is also a topic of ever-increasing relevance. Finally, productronica is the perfect place to find the latest information about recycling systems and environmental-technology topics such as supply and recovery.

EMSNOW will be meeting and interviewing key industry figures: from market research, EMS executive teams, key technology suppliers and other power players to bring the latest forecasts and insights to our audience. Watch for videos and podcasts on EMSNOW.com in the coming weeks.

 

Meanwhile, if you are in Munich, be sure and stop by our supporters’ booths and tell them we sent you!

Aegis Software invites attendees to schedule a meeting and learn about FactoryLogix:

FactoryLogix’ highlights: Simple connectivity featuring IPC CFX and our PLC Gateway; Simple adoption, with a highly configurable user interface, no-code platform; Simple AI with our latest ARIATM Copilot use case (with Arch Systems); and Simple ROI, discover our new Preventive Reports.  Aegis is in Hall A.480

As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics/

They will showcase their power electronics and solder solutions in Hall A4, Stand 309.

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets.

Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology. Koh Young will introduce new software, algorithms, and inspection capabilities combining True 3D measurement with AI and automation to enhance quality, efficiency, and process control.

 

Mycronic invites attendees to “Build a factory that goes with your flow.”In times of change, they say, only the most agile are equipped to thrive. With scalable production capacity. Predictive planning. And comprehensive process data that gives full visibility into the resources that drive profitability.​ MYPro Line Assembly Solutions are built to keep you in control of changing workflows. With end-to-end integrated process control. And the latest AI-assisted workflows that transform production data into real-time productivity gains. As markets evolve, supply chains shift and technologies change, there’s no better way to build more boards with less effort – and zero defects. Mycronic will be at Booth A3.249

 

 

Meet SEHO in hall A4, stand 578! Experience the world of soldering technology up close with SEHO: Optimized for demanding applications in electromobility and power electronics, impressive with sophisticated process architecture, high flexibility, and consistent focus on efficiency.

Get inspired and see what is already possible today to make your production sustainable and future-ready! SEHO is demonstrating Selective Soldering, Wave Soldering and THT inspection systems.

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