NHanced Semiconductors to Commission Advanced Package Assembly Facility In Indiana January 19, 2024

U.S. Senator Todd Young (R-IN) will join NHanced Semiconductors President Robert Patti for the ribbon-cutting at its new facility in Odon, Indiana on January 19, 2024

ODON, IN  – NHanced Semiconductors, a US-based pure-play advanced packaging foundry specializing in leading-edge technologies, will host a ribbon-cutting for its NHanced WestGate Facility, a multimillion-dollar advanced package assembly center. The new facility features two state-of-the art cleanrooms for semiconductor advanced package assembly and test, as well as process development. This represents the first phase of major investments by NHanced to establish a leading-edge semiconductor ecosystem in Indiana.

The event will be held inside the NHanced WestGate Facility with a ribbon-cutting and remarks by NHanced president Bob Patti; U.S. Senator Todd Young (R-IN); Andrea Richter-Garry, senior VP of the Indiana Economic Development Corporation (IEDC), representing Indiana Governor Eric Holcomb; and Dr. Angela Lewis (SES), Technical Director for the Naval Surface Warfare Center, Crane Division (NSWC Crane). They will discuss the federal and state governments’ commitment to support a world class semiconductor and microelectronics hub in Indiana.

The NHanced advanced package assembly line is designed as part of WestGate One – a multi-company complex that will be the first semiconductor foundry in the US built specifically for advanced package manufacturing. NHanced will be the anchor tenant, along with three other semiconductor companies, at the ten-acre public-private development.

The combined companies of WestGate One are expected to create more than 500 high-tech jobs with average salaries of more than $100K/year. Both the companies and governments have announced commitments to support training initiatives for the new workforce.

Members of the media are invited to attend the live event.

When: Friday, January 19^th from 1:00pm to 3:00pm.

About NHanced Semiconductors, Inc.

NHanced Semiconductors is the first pure-play advanced packaging foundry in the US, specializing in leading-edge BEoL semiconductor technologies including chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.

Headquartered in Illinois, NHanced also has a development and manufacturing facility near Research Triangle Park, NC, performing small volume manufacturing, in-house process development, and customer prototyping.

To attend the event, please contact:

Marcy Medina, NHanced Semiconductors

(812) 340-7503

mmedina@nhanced-semi.com