MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
The lawsuit seeks damages and a court order to stop SZLQ from making, using, selling, or offering for sale its high precision eutectic mounter infringing on MRSI Systems’ patent (Patent No. 201680048482.5), titled “Die Placement Head with Turret”.
In 2021, a new legal entity in China – MRSI Automation (Shenzhen) CO., LTD was established, and a new Product Demonstration Center in Shenzhen was launched. As part of long-term commitment to China, MRSI Systems places a strong emphasis on the local R&D, business development, strategic investments and stringent IP protection to foster innovation and customer success in China.
About MRSI Systems, LLC
MRSI Systems, LLC is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy
die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid
dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices
such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, copackaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels
including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we
meet our customers’ needs with meticulous attention to detail and 24/7 field support. For more information visit
www.mycronic.com/product-areas/die-bonding/.
