Master the PCB Troubleshooting Process with IPC Three-Week Course Starting September 13, October 26 in Europe

Identify PCB defects and determine solutions. Learn to troubleshoot specific defects and identify where in the manufacturing process the defect originated.
IPC’s three-week course, PCB Troubleshooting and Defect Analysis, starts September 13.
After completing the course, students will be able to diagnose the root cause and prescribe corrective action for:
  • PCB defects such as interconnect separation, delamination, wedge voids, plating folds and more
  • Electrodeposition defects like mouse bites, pitting and domed or crown plating
  • Solderability and assembly related issues such as outgassing, black pad, creep corrosion and blow holes
We’re also offering this course at a more convenient time for our European colleagues starting October 26.

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