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MacDermid Alpha Electronics Solutions to Feature Solder Joint Ruggedization Solutions at SMTA Rocky Mountain Expo & Tech Forum and SMTA Dallas Expo & Tech Forum

South Plainfield, NJ USA – The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.

Alpha and Kester will feature technologies engineered for enhanced reliability through ALPHA
CVP-390V
and Kester NP505-HR solder pastes with the industry leading high reliability Innolot alloy.

“The need for devices to withstand a high degree of mechanical stress, such as vibration, drop shock, and thermal cycling, is increasingly essential as the complexity of assembly designs expands across markets, including industrial, handheld computing, and automotive electronics,” stated Paul Salerno, Global Portfolio Manager, SMT. “MacDermid Alpha Electronics Solutions offers a suite of technologies incorporating high performance alloys, flux chemistries, and polymer reinforcement materials that provide a full spectrum of material design solutions to meet the increased reliability performance requirements demanded of these devices.”

Other technologies to be promoted are Alpha and Kester’s low temperature solder pastes and the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.

For additional information about MacDermid Alpha’s industry-leading assembly products and solutions, please visit MacDermidAlpha.com.

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