Kulicke & Soffa to Participate at SEMICON West 2018
Kulicke & Soffa will be showcasing its latest GEN-S high performance wire bonder, RAPID™ Pro. This new platform delivers advanced process capabilities to improve production processes supporting smart manufacturing. Real-time process monitoring, equipment health monitoring, diagnostics and traceability ensure the highest quality and efficient assembly of automotive and high performance semiconductor packages.
In addition, K&S will also be featuring the Asterion™ EV wedge bonder and the iFlex T2 electronics assembly machine. The Asterion™ EV is built on an architecture with enhanced capability to address the industry’s growing and changing applications needs. This single platform can handle a multitude of interconnect materials such as large aluminum wire, PowerRibbon™ and interconnects for battery cells. The iFlex T2 is designed with an increased feeder capacity of 25% and excels at multi-part tray feeding. This multifunctional flexibility makes it a perfect standalone or end-of-line solution for the most demanding, high-mix applications.
Nelson Wong, Kulicke & Soffa’s Senior Vice President of Ball Bonder Business Unit, said, “The semiconductor market continues to evolve rapidly with increasing demand for assembly and packaging technologies. K&S is well positioned to address these new challenges and continues to invest in developing innovative offerings to support our customers as they transition to Industry 4.0 initiatives.”
Customers can view these technical solutions at the SEMICON West 2018 trade show, North Hall, Booth #6052.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)