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IPC Extends Call for Participation in Electronics Materials Forum

Deadline extended to March 13

Join us for the IPC Electronics Materials Forum as a presenter and share your expertise on electronics materials. IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum to be held June 18, 2020 in Raleigh, NC, in conjunction with IPC SummerCom.

The Electronics Materials Forum will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. The content will focus on materials for board fabrication, assembly, and post-assembly protection.

Expert technical presentations are being sought in the following areas:

Substrate Materials:

  • Novel board laminates
  • Surface finishes
  • Solder mask advancements
  • Flexible/wearable circuits
  • HDI developments

Assembly Materials:

  • New solder alloys
  • Flux development
  • Cleaning chemistries
  • Assembly process strategies
  • Thermal interface solutions

Protective Materials:

  • Cleaning chemistries
  • Conformal coatings
  • Adhesives
  • Underfills

Submit your abstract by March 13, 2020 by emailing Brook Sandy-Smith, IPC technical conference program manager.

For information on sponsorship or table-top exhibitor opportunities please contact Alicia Balonek, IPC senior director, tradeshows & events.

For further information on this event, please contact Brook Sandy-Smith, IPC technical conference program manager

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