November 25, 2025 | 9:00–10:00 AM EDT
As AI and high-performance computing (HPC) systems reach unprecedented power levels, thermal management is more critical than ever. Join us on November 25 for a technical deep dive into advanced Thermal Interface Materials (TIMs) that enable reliable cooling in high-density platforms.
What You’ll Learn:
• How metal-based and hybrid TIMs improve heat transfer and mechanical stability
• Performance comparisons across greases, phase-change materials, liquid metals, and Indium-based alloys
• Strategies for long-term reliability under thermal cycling, vibration, and humidity
Featured Speaker:
Dr. Jie Geng – R&D Manager, TIM Group, Indium Corporation: Where he leads the development of advanced Thermal Interface Materials (TIMs) and innovative testing methods for thermal product evaluation.
Whether you’re designing next-gen GPUs or optimizing packaging for extreme workloads, this session offers actionable insights into cooling the future of electronics.
Registration
This webinar is open to industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile.
For additional information, please contact Masahiro Tsuriya ([email protected]).
Register Now to reserve your spot!
