Low-Temperature Material Discovery and Characterization
for First-Level Interconnect Project
Interim Report: Reliability Study Results
June 18/19, 2025
One of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way. Key modulators for reliability are the maximum temperature that the silicon chip experiences during assembly bonding processes, interaction with chip warpage, and solder joint reliability.
INEMI’s Low-Temperature Material Discovery and Characterization for First-Level Interconnect Project has conducted simulation studies of low-temperature solder materials, including SAC305, eutectic SnBi and SnBiCuNi, using solder package structures with solder sphere and Cu pillar interconnections.
The project team will share results from these studies, including bump collapse simulation, thermal mechanical simulation and electromigration simulation. We will also talk about future plans for the project.
Webinar Speakers
Russel Kastberg (IBM), Project Co-chair
Webinar moderator
Gokhale Shripad (Intel), Project Chair
Topic: Bump collapse modeling and simulation results
Kei Murayama (Shinko)
Topic: Electromigration modeling and simulation results
Yasuharu Yamada (IBM)
Topic: Thermal mechanical modeling and simulation results
Registration
This webinar is open to industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Masahiro Tsuriya ([email protected]).
Thursday, June 19, 2025
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT on Wednesday, June 18 (Americas)
Get additional details and link to registration.
INEMI Council of Members Meeting (June 9/10)
INEMI members — be sure to register for the 2025 INEMI Council of Members meeting. Sessions are scheduled on June 9 and 10. This is our annual members meeting (see member list) where we review the past year’s activities, talk about our priorities for the year ahead, share our successes, and ask for your feedback and input. Get additional details.
