Industry 4.0 PCBA Inspection M2M Solution at NEPCON Japan 2018
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join NEPCON Japan held at Tokyo Big Sight to showcase its Industry 4.0 Inspection solution, YMS 4.0, along with TRI’s complete PCBA manufacturing Inspection solutions. Visit TRI at booth #E33-4 and discuss your quality issues with TRI’s experts.
TRI’s VP of Sales and Marketing Jim Lin commented on the occasion: “The PCBA manufacturing industry has never been so close to experience the full Industry 4.0 Solutions. Visit TRI during NEPCON Japan to experience TRI’s YMS 4.0 solution and discover the benefits of real time M2M communication for centralized inspection!”
The highlights of TRI’s portfolio will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI. Built with CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing. TRI will also present the TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing.
Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Our experts will demonstrate the advantages of TRI’s Industry 4.0- ready smart inspection software and our high performance hardware design can bring to your production.