Indium Corporation to Showcase Technical Content at PCIM Europe E-Mobility Area and Forum
Indium Corporation will showcase material from its vast library of technical content during the E-mobility Forum at PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.
Trade visitors will be able to visit the E-mobility Area to examine specialized booths focused on electromobility, including new developments and challenges in power electronics due to the evolving electric automotive industry. Additionally, Indium Corporation will deliver a presentation at the E-mobility Forum on May 9.
Seth Homer, Product Manager, Engineered Solders, will present The Impact of Solder Alloy Integrity in Power Electronics, which discusses the role of solder alloys on power electronics designs amid challenges for improved reliability and performance. Some of the criteria to be discussed include alloy homogeneity, purity, and the impact of dimensional tolerances.
Homer has more than 20 years of industry experience in both manufacturing operations and marketing roles. He is responsible for many of the company’s engineered solder products, especially as it relates to the power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
Indium Corporation will also feature high-reliability materials for automotive power solutions on the forum’s poster wall. Specially formulated to address a variety of issues in the automotive industry, these products include the following:
- Indium8.9HF Solder Paste offers enhanced electrical reliability and no dendritic growth.
- InFORMS® optimizes solder volume with high-reliability solder preforms and ribbon.
- Heat-Spring® and HSMF thermal interface materials (TIMs) provide superior thermal management in power modules.
Indium Corporation is also exhibiting at the show and will feature the high-reliability products reviewed in their experts’ presentations, as well as other high-performance thermal interface materials designed to improve first yields. For more information about other research by Indium Corporation’s experts, visit www.indium.com/techlibrary or look for their technical engineers at the show in hall 6, stand 108.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.