Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Electrical reliability is a must-have for electronic components and products to work properly, especially when issues like ionic contamination under low stand-off components can cause dendritic growth which can lead to intermittent operation or short-circuiting and ultimately field failures.
Indium8.9HF is an air reflow, no-clean solder paste specially formulated to enhance electrical reliability and eliminate dendritic growth in high power products, such as automotive electronics manufacturing.
Indium8.9HF delivers peace-of-mind, knowing that assemblies will maintain integrity with:
- Increased electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Improved thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure
Indium8.9HF can accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
For more information about Indium8.9HF Solder Paste, visit www.indium.com/avoidthevoid or stop by booth #3133 at the show.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.