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Indium Corporation to Feature Four Presentations at SMTA Pan Pacific

Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.

Monday, Jan. 30

Tuesday, Jan. 31

  • AI and Intelligent Transportation: Perception Versus Reality by Lasky

Wednesday, Feb. 1

  • Experimental Analysis of the Effect of Void Area, Void Morphology, and Alloy Composition on the Total Thermal Resistance (Rth) of a Soldered Thermal Interface by Technical Support Engineer Ryan Mayberry
  • Gallium: A Versatile Metal with Many Possible Applications by Lasky

Dr. Ronald Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.

Ryan Mayberry is a Technical Support Engineer based at Indium Corporation’s global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to joining Indium Corporation in 2021, Mayberry was an R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.

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