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Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications at PCIM Europe

Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.

 

InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality. While InTACK™ has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.

InTACK™ technology is specifically designed to achieve high-quality solder performance

with no residue in flux-free reflow techniques commonly used in power module assembly. Benefits of InTACK™ include:

  • Maintains precise assembly alignment
  • Compatible with solder preforms, dies, and power module components
  • Robust tacking and long working time
  • Optimal performance in formic acid/vacuum reflow
  • No residue, no cleaning
  • Dispensing application tested and process proven

For more information about InTACK™, contact Indium Corporation Product Manager – ESM/Power Electronics Joe Hertline at jhertline@indium.com.

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