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Indium Corporation Experts to Present at IMAPS Device Packaging Virtual Conference

Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.


The high-performance computing (HPC) module market is seeing some enormous simultaneous changes. The compute needs of XPU and tensor processors are causing die area to grow, with higher areal power density, and HBM DRAM stacks are now located immediately adjacent to the processor. In Thermal Interface Materials in the HPC Era, Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Materials Applications, will discuss how metallic thermal interface materials are providing the low thermal resistance, high reliability, and flexibility for advanced compute modules and systems, in both TIM1 (die-lid), TIM2 (lid-heat-sink) and TIM0 (1.5) (die to heat-sink) applications.

Applications of silicon carbide-based power modules in various high-reliability fields, such as electric car, aerospace, and, deep well oil/gas extraction, enable next generation power semiconductor devices that can endure harsh operating conditions. The heat-resistant packaging of the modules needs to secure reliability at extremely high operating temperatures (maximum temperature 250°C), essentially higher than that of the current Si devices (maximum temperature 150°C). To address these challenges, high-temperature bonding technologies are in urgent demand. In Pressure-Less Silver Sintering Paste for Die-Attach on Bare Copper Surface Using Conventional Reflow Oven under Nitrogen AtmosphereDr. Sihai Chen, Research Chemist, presents the development of new silver sintering pastes where die can be attached on a bare Cu surface and processed using a reflow oven under nitrogen atmosphere. Dr. Chen will also study the joint strength obtained under different profiles, as well as substrate differences, and methods to reduce voids in silver sintering joints.

The semiconductor industry is quickly adopting heterogeneous integration as a solution to allow a large number of dies to be packed onto smaller components, improving cost-performance while also expanding functionality. As such, the printing of solder paste formulated for System-in-Package (SiP) applications is becoming more difficult, with many depositions which were once designed as extremes during testing now becoming the industry norm. This paper will first briefly discuss the evolution of soldering material for heterogeneous integration, as some aspects of solder paste manufacturing, such as powder size, differ significantly from larger scale soldering applications. In Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration AssemblyEvan Griffith, Product Specialist, will review critical parameters for the printing of SiP paste. Multiple parameters that are important for SiP paste printing applications will be discussed, such as the metal load optimization, paste rheology, and metal powder size, type, and quality.

Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication, and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie is also responsible for the development of Indium Corporation’s Applied Technology Roadmap. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. He is an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology, and holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a PhD in physical chemistry from the University of Nottingham, UK, and a Master of Science (MSc) in colloid and interface science from the University of Bristol, UK. He is an alumnus of the UC Berkeley Product Management program.

Dr. Chen specializes in silver sintering paste product development and has authored several of Indium Corporation’s patents for silver sintering paste, thermal interface materials, heat dissipating paint, and indium bump bonding. He has been published in many of the world’s leading scientific journals, including the Journal of the American Chemical SocietyNano LettersLangmuir, and The Journal of Physical Chemistry, and he has also been a reviewer for some of these publications. Dr. Chen obtained his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Prior to joining Indium Corporation, he conducted research at Clemson University and Duke University. Dr. Chen also has extensive research experience in nanomaterials in Germany (Max-Plank Gesellschaft scholarship recipient) and Japan (JSPS fellow), as well as in the U.S. He holds a Six Sigma Green Belt and is certified as an IPC Specialist for IPC-A-610.

Griffith is a Product Specialist for SEMI/SAAM fluxes and SiPaste® materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ enquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.