Indium Corporation Expert to Present During Power Electronics Webinar Hosted by EPP October 19

Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present as part of EPP’s free web session on power electronics on October 19.

Power electronics are used in a wide range of applications, including energy transmission and conversion, electromobility, renewable energy, industrial equipment, and electric drives. Power electronics assemblies require the manufacture of the components and their assembly into a functional electronic assembly. The exact manufacturing processes vary depending on the type of power electronics assembly, the area of ​​application, and the specific requirements. To ensure high product quality and reliability, the manufacture of electronic assemblies for power electronics requires specialized facilities, qualified personnel, and strict quality control measures.

Andreas’ presentation, Reliable Cooling of Power Modules Through Optimized Solder Materials, will examine the use of optimized metal TIMs (thermal interface materials) in the context of power electronics manufacturing.

“High-performance power semiconductors such as SiC/GaN enable the design of high-performance power modules,” said Andreas. “An optimized thermal connection to the cooling system is vital to reliably harness this performance.”

Andreas serves as Technologist – Advanced Applications and Technical Manager for Germany, Austria, and Switzerland for Indium Corporation. He has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovate LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.


About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

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