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Indium Corporation Expert to Present at SiP Conference China

Indium Corporation’s Leo Hu, senior area technical manager – East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai, China.

The industry has seen a surge in demand for system-in-package (SiP) devices, which are capable of increased functionality and higher performance, as well as other benefits, in a smaller package design. These advantages—combined with heterogeneous integration—continue to push miniaturization forward in the quest to create smaller stencil apertures (such as below 90µm) and tighter gap between pads (such as below 50µm). At the same time, these advancements have necessitated more critical solder paste printing requirements. In Fine Feature Solder Printing for SiP, Hu will examine Type 6 and Type 7 ultrafine pitch solder paste printing, commonly used for these applications due to the smaller aperture designs. He will also share data that explains the influence of powder size vs. area ratio, how powder size affects printing performance, application notes, and a related case study.

 

Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

 

For more information on Indium Corporation’s ultra-low residue fluxes, visit www.indium.com/fluxes or visit Indium Corporation’s booth.

 

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

 

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

 

SiP Conference China

SiP Conference China is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise, and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries, as well as material and equipment suppliers.

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