Indium Corporation Expert to Present at SEMICON China
The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials. In Soldering Material Evolution for Heterogeneous Integration, Lim will outline trends in various soldering material technology for heterogeneous integration, including solder paste, flip-chip, and ball-attach fluxes.
Lim manages the semiconductor product lines for the Asia region and works closely with the internal sales and research and development (R&D) teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move toward heterogeneous integration.
Some of her recent work includes the development of materials and processes for advanced packaging for fine-feature printing for SiP application, as well as for one-step OSP ball-attach applications. Lim has more than 25 years of experience, specifically in the areas of PCB assembly and surface mount technology. She joined Indium Corporation in 2007 as a Technical Manager in Southeast Asia. Prior to that, she was a Research and Development Chemist, focusing on solder paste and flux formulation. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer, has earned her Six Sigma Green Belt designation, and is heavily involved in many research and road mapping organizations.
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Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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