Indium Corporation Expert to Participate in Low-Temperature Solders Debate

Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time).

CREATOR: gd-jpeg v1.0 (using IJG JPEG v80), quality = 90 Following Global SMT & Packaging’s successful June debate on low-temperature solders, the December event will revisit the topic by examining some of the latest techniques, as well as materials and processes to meet the challenges of working with low-temperature solders.

The debate will be followed by a live Q&A session.

For more information or to register for the debate, visit

If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at

Nash is the Product Manager for Indium Corporation’s PCB Assembly Solder Paste. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. He also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. Nash joined Indium Corporation in 2005. He has authored several process and technical guidelines and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee. Nash has bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and is a Certified SMT Process Engineer.

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.


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