Indium Corporation Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March 5-7 in Phoenix Arizona. The presentation, Gold
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering. Rolling Meadows, Illinois – BEST Inc., a
When it comes to manufacturing medical devices that can save lives or enhance one’s quality of life, only materials of the highest standards will do.
Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics
