Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT), November 8-10,
Indium Corporation’s Sze Pei Lim, Regional Product Manager, will host an InSIDER Series webinar on soldering material technology for heterogeneous integration on Webex at 8:30 a.m. Singapore
Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China. Low-temperature soldering is not a “one
Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will host a 45-minute Thermal LIVE™ webinar on Oct. 20 at 10 a.m. Eastern/7:00 a.m. Pacific/3 p.m.
New low cost lead free silver free alloy Delta 99C® Composition: Sn99.3/Cu0.7/Ni<0.1/Ge<0.01 alloy is now available as an option to combine in the manufacturing process
