Reports suggest that TSMC has notified its Chinese clients of a temporary suspension on shipments of advanced AI chips produced using 7nm and below process
IPC just released another video in its series of short explainers supporting its chips-related advocacy campaign – this one focuses on the need to take
By Dr Yu-Han Chang, Principal Technology Analyst at IDTechEx Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing
MILPITAS, Calif. ─ Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of
TAIPEI, Oct 31 (Reuters) – Taiwan shut down ahead of the arrival of strong Typhoon Kong-rey on Thursday with all cities and counties declaring a
