MILPITAS, Calif. – Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of the
TSMC continues to reap the benefits of strong demand for 7nm and 5nm devices. As expected, most IC suppliers experienced weaker demand and generally poor
Spot prices have risen for certain types of memory chips recently, leading to significant market speculations on whether the entire memory industry could see a
Intel launches 11th Gen Intel® Core™ processors with Intel® Iris® Xe graphics, the world’s best processors for thin-and-light laptops1, delivering up to 2.7x faster content creation2,
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP)
