Electronics engineers, technologists, and industry leaders have a strategic advantage at this year’s Advanced Electronic Packaging Conference, the premier technical conference at APEX EXPO 2026, where 80+
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026,
This year marks a major milestone: it’s the first APEX EXPO since IPC rebranded as the Global Electronics Association, reflecting the organization’s broader focus and
HANZA BMK, formed from the merger of the electronics service provider BMK and the Swedish HANZA AB, celebrates its first appearance as part of Europe’s
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will exhibit at SEMICON Korea 2026, held February 11–13,
