Global notebook unit shipments for the first quarter of 2020 are estimated to experience a larger sequential fall of 29-36% than 17% projected earlier, as
Leaders in memory IC and foundry production maintain strongest capacity presence. IC Insights recently released its new Global Wafer Capacity 2020-2024 report that provides in-depth
Atlanta – ECIA’s most recent podcast is a far-reaching discussion between Bill Bradford, ECIA’s President and CEO and Michael Knight, President of the TTI Semiconductor
The current climate of political instability, component shortages, productivity pressures and a slowing global economy continues to present some sizeable challenges for UK electronics manufacturing.
Technical challenges including the move to EUV lithography, sub-3nm process technology, 3D die-stacking technologies, and advanced packaging are expected to lift R&D growth rates. The
