The 76th year of the industry’s premier electronics packaging conference • A series of 16 Professional Development Courses • An expanded number of special sessions on critical
SEOUL, Korea – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss how data-driven transparency supports manufacturing resilience in electronics
PCEA Assembly Conference A fresh, focused event dedicated to board and electronics assembly April 30 – May 1, DCU Center, Worcester, MA Presented in partnership with PCB
Call-for-Participation Webinar Thermal Interface Material Performance Characterization Methodology Project, Phase 1 April 2/3, 2026 As high-performance computing and AI accelerators drive systems to unprecedented power
The semiconductor industry is hitting a structural inflection point: explosive AI‑driven demand, rapidly rising manufacturing complexity, and stringent sustainability expectations are converging at once. In
