As thousands of young people across the West Midlands prepare to receive their A-level and GCSE results this week, Make UK has highlighted the growing
Atlanta – ECIA Chief Analyst Dale Ford has released his latest Industry Sentiment report based on the Electronic Component Sales Trend survey of July 2021. The
Atlanta – ECIA is pleased to announce that the latest Channel Channel Podcast is now available, featuring ECIA President David Loftus’ interview with ECIA Foundation President Jim Kaplan.
Minneapolis, MN – The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging:
Five key themes are combining to define the current economic environment. These include supply chain constraints, manufacturing optimism, inflationary pressures, a tight labor market and
