The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done
IPC’s Validation Services Program has awarded an IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards Qualified Products Listing (QPL) to Ventec International
Industry is facing numerous challenges. It needs to reduce energy consumption due to sharp cost increases, reduce its carbon footprint and at the same time
ECIA’s Electronic Component Sales Trend (ECST) February 2023 Survey Results Atlanta –ECIA’s Chief Analyst Dale Ford has posted the latest results from the Electronic Component
AMSTERDAM/WASHINGTON, (Reuters) – The Netherlands’ government on Wednesday said it plans new restrictions on exports of semiconductor technology to protect national security, joining the U.S.
