Call for Papers: EIPC Winter Conference, Milan, Italy February 14-15, 2019

The European Institute for the PCB Community (EIPC) issued a call for papers for its Winter Conference Feb. 14-15 in Milan, Italy.

Conference location: NH Hotel Milano Fiera, Italy
Bonus Programme: Visit to Elga Europe

EIPC Winter Conference Milan 2019
“European Technology for the global PCB/Electronics Industry”
Presentations on the following topics can be included in the conference programme:

Keynote / Trends
-Business Outlook: Global Electronics Industry
-Automotive, E-mobility and High Rel application, Radar High Frequence
-Industrial Electronics, Lighting Transportation, Metal Core PCB, Space, Avionics-G5, Medical
Reliability /traceability requirements by Application Tools for Reliability
-Responsibility for Product Reliability and Safety -What Testing is needed and how to
-Standards for Product Safety and Reliability measure Reliability
-Inhouse process control and conformation Testing -How to ensure product Safety and
-Material and finish product Safety and Testing Reliability
-Advanced supply chain and Third party Testing
Design & New Technologies
Success through Evolution- or Disruptive Technologies?
-PCBs in Polymer Technology
-Printed Electronics
-Material Technology- Laminate technologies – Coating technologies
Equipment evolution to meet Technology challenges
-HMLV High Mix Low Volume
-Imaging and Printing
-Controlled line etching, Copper thickness tolerances
-Embedding and Metal Core PCBs
-New technology, Innovations and Invention
Roadmapping on Automotive, Radar, Trains, Avionics, Lightening
-What input is provided through “Roadmap by market segments”
-Technology Guidance through market needs
-Adapting processes, materials, chemistry, equipments to future technology needs
-Strategic Partnership and planning for success through Networking

Please click here for the detailed Call for Papers.

Please click here for the abstract submission form.

Please click here for the conference registration form.