BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China
February 2018 — BTU International, Inc., a supplier of advanced thermal processing equipment for the electronics manufacturing market, will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.
TrueFlat technology is an optional configuration of the PYRAMAX™ convection reflow oven for substrate flatness.
Designed for substrate thicknesses of 0.15 to 0.30 mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to PYRAMAX’s closed-loop convection heating.
The new PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.
For more information about BTU International, visit www.btu.com.