From the Show Floor: APEX 2026 – Anders Lindqvist, CEO and Kevin Clue, VP Global Sales, Mycronic
EMSNOW’s APEX 2026 interview with Mycronic includes an unexpected update from their CEO Anders Lindqvist who provides the C-Suite view of how this innovative company is seizing opportunities from the many driving forces operating on the industry in these interesting times. Kevin Clue, VP of Global Sales adds the tactical details about how they are […]
Benchmark Releases Commitment to Sustainability: 2025 Sustainability Report
Releasing Benchmark’s Sustainability Report each year is an important moment to reflect on progress, accountability, and the discipline required to turn commitments into measurable results. With the release of our 2025 Sustainability Report, we mark our fifth consecutive year of transparent reporting and continued advancement of sustainability as a core element of how we operate and […]
Bytesnap Design publishes PCB design requirements for consumer, industrial and aerospace applications
Longbridge, UK – — ByteSnap Design has released “PCB Design Requirements: Consumer vs Industrial & Aerospace Applications – Complete Guide 2026.” The report examines how PCB design constraints change across consumer electronics, industrial systems and aerospace platforms, particularly in relation to environmental conditions, reliability targets and lifecycle expectations. In consumer products, PCB design is typically driven by cost targets and […]
Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the U.S. and Canada
Duluth, GA – Koh Young America, an industry leader in True 3D measurement-based inspection solutions, announced two changes within its North American organization. Dave Nemeth has been named Sr. Manager, Eastern Regional Sales, covering eastern Canada and key territories across the eastern and midwestern United States, while Mitchell Kim has been appointed Manager of Service […]
ECTC 2026 Registration is Open
The premier international conference for electronics packaging, components, and microelectronics systems technology. ECTC brings together more than 2,000 professionals from across the global microelectronics and semiconductor packaging industry, including manufacturers, design houses, foundries, material suppliers, universities, and investors. This year the ECTC has over 450 technical papers covering advanced packaging technologies such as wafer-level and […]