Why Electronics is at the Center of the New Industrial Strategy Debate
Three influential Substack essays are reshaping the debate on industrial strategy, technology competition, and the electronics industry. They show how falling costs in the electric stack and China’s strength in modular manufacturing are redefining global competitiveness. They also highlight why mature-node semiconductors remain strategically critical alongside AI and leading-edge chips. By Chris Mitchell, chief advocacy […]
IMI Shifts From Turnaround Mode To Focused Growth – with CEO Lou Hughes
They didn’t just trim costs. They rewired the business for the next growth cycle. Philip Stoten sat down with Lou Hughes, CEO of IMI (Integrated Micro-Electronics Inc.), to unpack a pivotal year that includes sharp net debt reduction, major site consolidation, and a clear shift from stabilization to expansion. If you care about EMS strategy, […]
Scanfil Signs Agreement with Leading Industrial Automation Company
Scanfil has signed an agreement with a leading industrial automation company, part of a global technology group, strengthening its position in demanding industrial automation and electronics manufacturing applications. The initial scope of the agreement represents a business volume of EUR 25 million. Scanfil production network will support the customer’s global supply chain, manufacturing, and sustainability […]
Incap India invests in testing and SMT upgrades to scale production
Incap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory. The approximately EUR 1.53 million investments increase the factory’s production capacity and improve operational efficiency. The investments support growing customer demand for testing smaller and more complex products and enable […]
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC May 26-29
CLINTON, N.Y. — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida. The presentation, Fluxless Vacuum Formic […]