From Shortage to Surplus: Why Distributors Are Key to Circular Resilience
Following a period of historic supply chain volatility, the electronics industry now finds itself at a pivotal inflection point. While the semiconductor shortages that dominated discussions from 2021 to 2023 have largely eased, their ripple effects continue to unfold. In 2025, EMS providers, OEMs, and distributors are facing a new and equally complex challenge: structural […]
Aimtron Signs ODM contract with Leading US Infrastructure Firm
Aimtron’s Commitment to design & manufacture Advanced UPS Systems Aimtron Signs ₹97.55 Crore contract for ODM in digital infrastructure and continuity solutions sector This deal highlights Aimtron’s growing role in delivering customized power solutions for global clients. India – Aimtron, a fast-growing Electronics System Design and Manufacturing (ESDM) company, has signed a strategic ₹97.55 crore […]
ECIA/EMSNOW Date Code Restrictions Webinar Part 2 – July 16
ECIA Webinar Part 2: Inventory Date Code Restrictions – Perspective from Operations and Supply Chain July 16 | 11:00 AM Eastern | Register Today Join Christine Wolnik of ECIA and Eric Miscoll of EMSNOW for Part 2 of the ECIA webinar series on date code restrictions. This webinar will focus on the perspective from operations and supply […]
ECIA Announces New AI Market Analysis Reports
Powerful Research from AlphaSense for ECIA Members Atlanta – ECIA is pleased to announce an exciting new member benefit: ECIA members now have access to in-depth analysis performed by the AlphaSense generative AI tool to answer key questions regarding important industry-specific topics. These reports contain timely research on issues that inform intelligent electronic component and distribution industry […]
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at IPC Workshop
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the IPC Component-to-System Level Packaging Workshop, scheduled for July 2-3, 2025, in Berlin, Germany. The presentation, Solder as Known Good Interconnect (KGI) in Heterogeneous Integration, will explore how solder and low-melting metals […]