PCBAA Testimony at U.S.-China Economic AND Security Review Commission Hearing
Printed circuit boards are the foundational infrastructure of modern electronics. They serve as the essential platform connecting semiconductors to electronic devices, enabling functionality in everything from smartphones and automobiles to defense systems and medical equipment. Without PCBs, semiconductors cannot operate—highlighting the necessity of a robust and secure PCB manufacturing base to ensure the integrity of […]
PC Shipments Remained Strong in Q2 Signaling Vendors Getting Ahead of Tariff Deadlines, according to IDC
In line with IDC’s forecast, Q2 results show continued dynamism, but tariff jitters are starting to be felt in the US NEEDHAM, Mass– PC shipments during the second quarter of 2025 grew 6.5% from the prior year, with global volumes reaching 68.4 million shipments, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly […]
Up Close with Jeroen Tuik, CEO, Connect Group
EMSNOW catches up with Jeroen Tuik, CEO, Connect Group to discuss their recent announcement about expanded operations in the U.S. Connect Group is a top tier EMS in Europe with global facilities; its facility in Romania was featured on EMSNOW/in4ma’s 2024 On Tour. Connect Group has a complete suite of services and is one of […]
Kitron: Q2 2025 – Strengthening momentum
Kitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector. Kitron’s revenue for the second quarter was EUR 172.2 million. This compares with 164.6 million in the first quarter this year and 167.6 million in the second quarter last year. The Defence/Aerospace market sector showed particularly strong growth. Second-quarter […]
TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC
As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging plants in the U.S. in 2028, featuring SoIC (System-on-Integrated-Chips) […]