INEMI Roadmap webinar September 4 spotlights the future of board assembly technologies

Join us for an INEMI Roadmap webinar spotlighting the future of board assembly technologies — a vital component of the electronics manufacturing ecosystem.  September 4, 2025 11:00 a.m. – 12:00 p.m. EDT (North America) This session will highlight current roadmap insights and explore emerging trends across key areas, including: Assembly materials Surface mount technology Rework […]

Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven

CRANSTON, RI  — Federal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation. The new […]

Over 60% of Asia/Pacific Enterprises See Regulatory Disruption to IT Operations, Says IDC

Asia/Pacific enterprises face growing regulatory complexity as data, AI, and cybersecurity laws reshape digital infrastructure and governance priorities. SINGAPORE – More than 60% of enterprises across Asia/Pacific are already experiencing moderate to significant disruption to their IT operations due to evolving data privacy, cybersecurity, and AI regulations, according to the IDC report, Regulatory Turning Point: How Data Privacy, Cybersecurity, […]

Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices. WS-910 Flip-Chip Flux is designed to provide best-in-class residue cleaning for a water-soluble flip-chip flux, allowing for excellent compatibility with molded […]