Uniting for Sustainable Chips: Industry Leaders to Explore How AI Can Advance Energy-Efficient Manufacturing at SEMICON Taiwan 2025
Hsinchu – The surge in AI demand is driving a new wave of semiconductor innovation and accelerating the shift to green manufacturing. As AI chip use grows, the industry must adopt low-carbon and circular solutions, making green transformation key to sustaining semiconductor competitiveness. Kicking off September 8, SEMICON Taiwan 2025 will unite global leaders to explore […]
Mouser Electronics Releases Latest in Mouser Talks Tech Videos with Dean Kamen Interview
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, today released its latest Mouser Talks Tech video episode with renowned inventor Dean Kamen, founder of FIRST®. In this exclusive interview, Kamen talks about the impact of FIRST in inspiring students and fostering growth in science, technology, engineering, and math (STEM) careers. The Mouser Talks Tech video series shares perspectives from experts across the […]
The SMTA International 2025 Conference Program is here.
Explore the finalized 2025 Technical Conference program and register today to be part of the future of electronics manufacturing. Join us October 19-23, 2025, in Rosemont, Illinois, where engineers, scientists, and thought leaders gather to explore the next frontier in microelectronics. This year’s technical conference features six focused tracks covering additive electronics, advanced packaging, low-temperature solder, manufacturing […]
Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia. The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and […]
Waldom Electronics Highlights Industry Opportunity in New Article on UN Global Compact
Waldom Electronics has published a new article, “What is the UN Global Compact – and is the Electronic Components Industry Ready to Step Up?”, calling attention to the importance of corporate sustainability in the electronic components sector and encouraging greater industry participation in the United Nations Global Compact. The UN Global Compact, founded in 2000, […]