Breaking Thermal Barriers: Indium Corporation to Present Metal TIMs Solutions for Next-Generation Electronics at FINE 2026 June 10-12
CLINTON, N.Y. — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how advanced metal thermal interface materials (TIMs) can achieve new performance thresholds in next-generation electronics packaging at the Future Industries New Materials Expo (FINE) 2026, June 10-12, in Shanghai, China. The presentation, titled Addressing Advanced Packaging Thermal Challenges: Innovations and Applications […]
Up Close with Heriberto Cuevas Velázquez, Sales Manager Team Leader Mexico and South America
EMSNOW learns about Koh Young’s response to new challenges in Mexico and South America from that geography’s team leader Heriberto Cuevas Velázquez. With AI changing everything, he explains, training has taken center stage both internally, and for Koh Young customers.
Mexico and European Union sign modernized trade deal, eliminating tariffs on 99% of products
Mexico and the European Union (EU) have signed a long-awaited Modernized Global Agreement (MGA) as both sides seek to expand trade relations and diversify exports away from the United States so as to partially insulate themselves from U.S. tariffs. The accord, signed at an EU–Mexico summit in Mexico City, will reduce Mexican tariffs on European agricultural […]
Plexus Issues Fiscal 2025 Sustainability Report and Announces Transition to Absolute Emission Reduction Targets
NEENAH, WI — Plexus Corp. (NASDAQ: PLXS) announced the release of its Fiscal 2025 Sustainability Report. The report, which is now available on the Sustainability page of plexus.com, marks a significant evolution from intensity-based metrics to measurable, absolute emissions reduction goals. The report details the company’s progress in environmental stewardship, social responsibility and corporate governance, […]
Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
Level-5 ChipStack AI Super Agent framework and NVIDIA OpenShell runtime advance secure, agentic AI across semiconductor development SAN JOSE, Calif.—At Computex 2026, Cadence (Nasdaq: CDNS) announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models, and secured by NVIDIA OpenShell runtime, the new agentic capabilities enable customers […]