Alpha Assembly Solutions to Focus on Low Temp Solders and Void Reduction with Multiple Technical Presentations at 2018 SMTA International Expo
Somerset, NJ – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present five technical papers and chair two panels during the 2018 SMTAI International Conference and Exhibition on October 14 – 18 held at the Donald E. Stephens Covention Center in Rosemont, Illinois.
Advancements in reliability and performance for low temperature solders and lead-free alloys are the focus of several of the papers being presented by Alpha. Among the presentations, Reliability of Low Tempertaure Solder Interconnects and Low Melting Point Materials Development reflect Alpha’s continued emphasis and expertise in this field. During the Expo, Alpha will be sharing in its booth the new eBook, “The Printed Circuit Assembler’s Guide to…Low Temperature Soldering“, published by I-Connect007 and written by several expert authors from Alpha.
In addition, new work on void reduction will be presented in the paper, Void Reduction/BTC Challenges in Assembly. “The work that we have done with several customers, and the on-going research by our R&D teams has contributed to furthering our understanding of voiding,“ said Robert Wallace, Regional Marketing Manger for the Americs, “and we have developed strategies and solutions to minimize its impact for our customers.“.
Alpha will feature the solutions for manufacturing created in conjunction with this research in Booth # 1115, including how low temperature solders, such as ALPHA® OM-550 and low-void technologies, such as ALPHA® BTC Preforms, can provide customers with improved results and lower total cost of ownership.
At the Expo, Alpha will be co-exhibiting with. Both Companies are a part of the MacDermid Performance Solutions group of businesses.
To learn more about Alpha’s latest technologies and products, visit Booth #1115 at SMTAI or visit the Alpha Assembly Solutions website at alphaassembly.com.