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The premier international conference for electronics packaging, components, and microelectronics systems technology. |
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ECTC brings together more than 2,000 professionals from across the global microelectronics and semiconductor packaging industry, including manufacturers, design houses, foundries, material suppliers, universities, and investors. This year the ECTC has over 450 technical papers covering advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, flexible and printed electronics. |
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Quality Inspection Report for Electronic Components
June 30, 2026
