ORLANDO, FL (January 5, 2026) – The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC 2026. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount.
Eligible participants currently enrolled in an undergraduate (BSc) / master’s (MSc) program, or doctoral (PhD) candidates from any university must pre-register by January 11, 2026 for one of the following three pre-defined challenges:
For BSc and MSc students
• Low-cost Robust Thermal Solution for High Power AI/Datacenter Processor
For PhD students
• Materials, Interfaces, & Processes for Ultra-Scalable Interconnects
• Electromigration Solutions for BGA Interconnects in AI-Focused Packages
On February 1, 2026, teams must submit a six-page report with their results and findings for the award and the organizing committee will announce up to six teams selected for the finalist round of the competition on February 28, 2026. These teams will have until May 15, 2026 to finalize their work and submit their presentations.
For more information about the student competition
Please visit: https://ectc.net/ectc-competition/
Follow ECTC on social media
- Flickr: https://www.flickr.com/photos/38916807@N07/albums/
- LinkedIn: https://www.linkedin.com/groups/1916290/
About ECTC, EPS & IEEE
The ECTC technical program addresses new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies relevant to electronics packaging.
The IEEE’s Electronics Packaging Society (EPS) sponsors ECTC. EPS is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing. It encompasses all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications, to biomedical engineering, electric power, and consumer electronics.
