INEMI Packaging Tech Topic Series October 28th: Harsh Environments


Electronic Processes for the Extreme: Reliability Challenges in Harsh Environments and Beyond

October 28, 2025 | 9:00–10:00 AM EDT 

SLB is pushing the boundaries of electronics performance in the most unforgiving conditions—extreme heat, pressure, shock, and corrosive environments. Join us for a insightful INEMI webinar exploring how advanced materials, packaging, and integration strategies are enabling reliable control and data transmission in downhole exploration tools.

What You’ll Learn:

  • How SLB designs electronics to withstand >200°C, >30,000 psi, and >500 Gs
  • Key failure mechanisms and how to mitigate them
  • Innovations in packaging, PWBs, and regulatory compliance (PFAS, RoHS)
  • Real-world deployment results in drilling applications

Featured Speakers:

Chintan Sanghani – Quality and Process Manager – Expert in high-reliability electronics manufacturing

Gilad Nave – Material & Process Engineer: Ph.D. in electronic materials; leads innovations in packaging and substrates

Mohamed El Hadachy – Technology Project Manager- Technology Project Manager with 20+ years in extreme-environment electronics

Registration

This webinar is open to industry; advanced registration is required.  For additional information, contact Masahiro Tsuriya ([email protected])

Register Now

Don’t miss this opportunity to learn from SLB’s leading experts and explore the future of ruggedized electronics in energy applications.

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