Join us for an INEMI Roadmap webinar spotlighting the future of board assembly technologies — a vital component of the electronics manufacturing ecosystem.
September 4, 2025
11:00 a.m. – 12:00 p.m. EDT (North America)
This session will highlight current roadmap insights and explore emerging trends across key areas, including:
- Assembly materials
- Surface mount technology
- Rework & repair strategies
- Press-fit applications
- CPU socket interconnects
You’ll also take part in a short brainstorming session to help shape the future of PCB technology and the next phase of INEMI’s Board Assembly Roadmap.
Speakers
Featured speakers are:
- Dr. Paul Wang, MiTAC International Inc.
- Jasbir Bath, Bath Consultancy LLC
Whether your focus is design, manufacturing, or materials, this webinar offers valuable perspective on long-term trends shaping electronics production.
Registration
This webinar is open to industry; advanced registration is required. For questions, contact Francis Mullany ([email protected]).
