It’s the 25th anniversary of APEX and time for OEMs, EMS providers, PCB manufacturers and industry professionals from around the globe to get together to access the latest technical content, contribute to standards development, and network with the industry’s largest gathering of capital equipment manufacturers, suppliers, and product innovators in design, printed board manufacturing, electronics assembly, and test.
The event offers nearly endless opportunities for education and networking. Attendees gain access to cutting-edge technologies, advanced materials, and the latest processes, equipping them with the knowledge, technical skills, and best practices to reimagine the possibilities to drive your business forward.
Monday is the EMS Leadership Summit
Industry veteran and talent guru Audrey McGuckin is set to deliver both a keynote address and workshop at the upcoming APEX EMS Leadership Day, focusing on the critical connection between talent strategy and business objectives. The session, scheduled for the Monday before the expo opens, promises to bring McGuckin’s practical, hands-on-sleeves-up approach to solving one of the industry’s most pressing challenges.
Other keynotes include Kevin Surace, Futurist, Visionary, and Inventor of Disruptive Innovation & Generative AI, who opens the conference; Dr. Ahmad Bahai, Senior VP and CTO, Texas Instruments opens Wednesday with a talk on Edge AI Developments and Chip packaging. Exhibits open 10 am Tuesday and Wednesday, then at 9 am on Thursday for the half day finale.
The following EMSNOW supporters will be at the show. If you are going, be sure and stop by their booths and give them your attention. They have groundbreaking products and technologies to demonstrate to you! Tell them EMSNOW sent you.
Aegis will be at Booth 1423 demonstrating their Digital Transformation software solution
Digital transformation is reshaping electronics manufacturing. While the outcomes of data-driven manufacturing are compelling—greater efficiency, more streamlined processes, engaged teams, and enhanced decision-making—it also presents a unique set of challenges for manufacturers striving to keep pace. To stay competitive, companies must understand how to harness the power of emerging technologies while simultaneously navigating workforce dynamics and operational complexities.
Download now to learn:
The technologies transforming digital manufacturing operations.
How to evaluate your progress in adopting advanced solutions.
Strategies for selecting the right path to drive growth.
Why adapting to these advancements is critical to staying competitive.
Schedule a meeting or stop by Booth 1423 to learn more.
Cetec ERP Exhibits its Cloud-based ERP System at Booth 2802
EMSNOW learns about Austin, Texas based Cetec ERP’s unique cloud-based platform from Tanner Rogers, the company’s Senior Consultant. This is a platform designed for difficult manufacturing environments like EMS/PCBA and delivers an all-in-one SaaS suite from sales and quoting to inventory management, document management, shop floor control, quality management, and financial accounting. Tanner explains the evolution of the company from the product launch in 2015, how customers have responded to its cost effective and easy to use features, and why the pricing model has resonated so well with the electronics manufacturing industry.
Tanner invites EMSNOW readers to visit the team at APEX 2025 in Anaheim. They will be in Booth 2802.
Delvitech to Officially Present hybrid AOI + SPI Horus System
Horus represents a revolutionary hybrid 3D inspection solution driven by Artificial Intelligence, capable of conducting both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI). Built on proprietary neural networks, it overcomes the limitations of traditional systems, adapting to the diverse variations that arise during production. This advanced technology enables Delvitech to offer an unparalleled inspection solution that integrates effortlessly into every aspect of Surface Mount Technology (SMT) production, redefining inspection processes with unmatched precision and efficiency.
X-Treme Series Auto Dry Cabinets will showcase latest innovation, X-Smart Light – Smart Storage Solutions, Booth 1614!
- Featuring Lifetime Tracking technology
- Equipped with Pick by Light technology for enhanced efficiency
- Integrated with MSDTrack tracking software for seamless inventory management
Join us at Booth 1614 to experience the next generation of smart storage solutions designed for precision, efficiency and reliability. Discover how X-Smart Light can revolutionize your operations!
Since 1987, EMT Electronics’ X-Treme Series Auto Dry Cabinets have been a leading brand in the industry, providing unparalleled protection for moisture-sensitive components, with UL certification and ISO 9001:2015 compliance.
Ultra-low humidity control (<0.5% RH) and advanced desiccant technology prevent oxidation while extending component life without heat damage with a rapid drying system. X-Treme Series Auto Dry Cabinets are a trusted choice in electronics, aerospace, medical and many more fields with more than 25 distributors and a sales network in more than 60 countries.
IDENTCO Demonstrates High-Performance Automation Solutions
As a leader in track and trace labeling for PCBs and electronic components, IDENTCO makes it simple to automate SMT labeling with a robust range of products including labels, printers, rewinders, presenters, print & apply, and custom solutions.
IDENTCO’s selection of label feeders provides precise and accurate placement for applications requiring both slim and wider label sizes. Half the size of conventional feeders, the IPS-30 Slimline Label Feeder requires only one feeder position, freeing up valuable space along congested SMT production lines. The IPS-45 label presenter is ideal for applications requiring a wider variety in label size.
Providing precise registration capabilities, the ELP-I thermal transfer printer features center-alignment and high-resolution 600 dpi printing, the industry standard for printing small 2D codes and text on miniature labels for SMT applications.
In addition to automation equipment, IDENTCO offers a comprehensive range of label solutions, including the DuraTrack Series, which can endure harsh fluxes, the latest cleaning chemistries, and high temperatures encountered in today’s circuit board assembly processes.
Designed for hassle-free integration, IDENTCO’s automation products offer plug-and-play functionality with most SMT equipment brands. Learn more today: https://identco.com/products/automation/
If you are attending the IPC APEX EXPO 2025, visit us at Booth 2632 to learn more about our high-performance automation solutions.
Indium Experts Share Technical Insight and Demonstrate Solder Solutions at Booth 1416
As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Tuesday, March 18
- Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.
- This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.
Wednesday, March 19
- Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.
- This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.
- Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.
- This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.
- Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.
- This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).
- Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jarrett.
- This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.
To learn more about Indium Corporation’s solder and TIMs solutions, visit www.indium.com or visit with our experts at Booth 1416.
Koh Young Showcases Inspection Innovations at Booth 2130
Koh Young continues to lead electronics manufacturing with groundbreaking solutions that simplify programming, enhance defect detection, and enable real-time process control. To help manufacturers overcome production challenges, increase yield, and reduce costs, Koh Young offers a range of advanced inspection solutions. The industry-leading KY8030 Series provides reliable, repeatable 3D measurement to optimize the print process, while the aSPIre 3 sets an even higher benchmark in accuracy and throughput. The Zenith Series delivers True3D inspection for trustworthy defect detection, addressing SMT component challenges and providing top and bottom THT inspection capabilities with an integrated board flipper. For 
mixed pin and SMT inspection, the KY-P3 lineup utilizes high-resolution optics and AI-powered vision algorithms to ensure unmatched accuracy and repeatability. The award-winning Neptune, featuring Koh Young’s exclusive L.I.F.T. technology, is the first high-speed 3D inspection solution capable of precisely measuring transparent material thickness at production speeds. AI-driven KSMART and Koh Young Process Optimizer (KPO) solutions enhance process automation, optimize defect detection, streamline programming, and provide real-time data insights—boosting production quality while reducing costs.
Koh Young’s commitment to excellence extends beyond innovative technology, as evidenced by its award-winning service team. Koh Young’s award-winning service team delivers industry-leading customer support through comprehensive training, proactive maintenance, and real-time assistance—ensuring peak machine performance. With a strong global presence and regional support teams, customers benefit from quick response times and tailored solutions that maximize equipment uptime, optimize processes, and enhance overall productivity. Koh Young’s dedication to customer satisfaction solidifies its position as a trusted partner in electronics manufacturing. Learn more>>
Collaboration for Seamless Integration
Beyond its own booth, Koh Young will also showcase its advanced solutions in partnership with industry leaders. Visit Panasonic Booth 830 to see the 8030-3 SPI and Zenith UHS AOI in action, demonstrating seamless connectivity and integration.
Discover the future of inspection technology at Koh Young Booth 2130. To learn more about Koh Young’s industry-leading solutions go to www.kohyoungamerica.com.
Mycronic demonstrates its full line of assembly solutions
With high flexibility, customers can reimagine the possibilities with a full-line offering. For example, our multi-machine programming tool MYPro Create is the next level for a unified programming solution. This software streamlines job creation across multiple systems for Jet Printer, SPI, and AOI – using a single data input, thereby enhancing productivity and consistency. And that is not all, here is what else will be showcased:
MYPro A40 models: deliver bigger volumes
The MYPro A40™ delivers the high accuracy and fast changeovers you expect from the icon of agility, together with a dramatic increase in throughput speed.
MYPro S30: precision printing for maximum yield
The Mycronic MYPro S30 stencil printer will showcase high-speed, precision printing for SMT assembly, ensuring superior quality and efficiency. With advanced automation, intuitive software, and quick changeovers, it minimizes downtime and maximizes throughput. Designed for reliability and flexibility, it adapts to diverse production needs, making it the ideal solution for manufacturers seeking consistent, high-quality solder paste applications.
DeepReview: AI-driven defect classification
Accelerating review times and reducing false calls, Mycronic’s DeepReview for 3D AOI solution enhances PCB assembly by automatically improving defect classification models over time. DeepReview, a new AI-based Automatic Defect Classification system for 3D AOI, allows full test coverage of any product without fear of false calls.
MYTower: automated material handling for increased efficiency
MYTower provides automated, intelligent, and safe storage of electronic components. To ensure that production lines are always running smoothly and efficiently, automation of material handling is important – especially in high-mix environments where job changeovers are frequent or in volume production replenishing components in a timely manner to ensure high equipment utilization.
Visit Mycronic at IPC APEX EXPO 2025 in Anaheim, CA, U.S., March 18-20 at booth #1842 to experience these groundbreaking solutions firsthand and discover how Mycronic is shaping the future of electronics assembly.
SEHO to Highlight Cutting-Edge Soldering Technology at Booth 849
SEHO is continuously developing its product range to create real added value for users. At APEX, the company will highlight the modular inline selective soldering system SelectLine-C. Many innovative ideas are integrated into the SelectLine-C and have made it one of the most successful in the SEHO portfolio.
The SelectLine-C machine concept is consistently modular thus ensuring clear cost benefits. Several modules can individually be configurated with fluxer, preheatings, soldering units, cooling modules, selective brush unit and AOI system. Thus, the SelectLine-C adapts to virtually any manufacturing requirement and if the production conditions should change it may be expanded, the configuration can be modified, or SelectLine-C modules can be shifted to different manufacturing lines at any time.
Starting from a basic module with two soldering units and a total of four workstations, the machine can be expanded to up to six soldering units and more than 15 parallel workstations.
Electro-magnetic soldering units with innovative nozzles for mini-wave and multi-wave soldering processes are part of the standard machine equipment. Maximum throughput requirements are met with the Synchro mode. This intelligent software feature coordinates the soldering process with several soldering units for one assembly type in such a way that the cycle time is nearly halved without the need for significant investment. If different products are manufactured in mixed operation, the SmartSplit mode ensures automatic split of the available soldering units, thus providing maximum throughput rates.
Automatic ultrasonic cleaning of solder nozzles is another highlight in the soldering area. Instead of manual maintenance with aggressive chemicals, the machine cleans the soldering nozzles automatically, gently and in an environmentally friendly manner.
The SelectLine-C is ideally suited for using the LongLife mini-wave solder nozzle. This nozzle type features a lifetime that is at least three times longer than that of conventional nozzles. Therefore, the annual savings potential is remarkable. In addition, maintenance requirements for the LongLife solder nozzles are significantly reduced.
Like all selective soldering systems from SEHO, the SelectLine-C provides a complete hardware and software package for 100% automated process control. The flux quantity monitoring system and gradient-controlled temperature profiles in the preheat area, automatic monitoring of the nitrogen quantity and nitrogen quality, the touchless wave height control or automatic setup control and tool measurement are only some of the monitoring functions that ensure a reliable process.
The SelectLine-C, however, has even more to offer. The machine can be equipped with a selective brush system for automatic removal of solder balls, and an AOI system for automatic inspection of solder joints immediately after the soldering or brushing process. The advantages of these integrated additional processes are obvious. Safe and reliable processes on the one hand and reduced overall production costs on the other hand.
White Horse Laboratories
