Identify PCB defects and determine solutions. Learn to troubleshoot specific defects and identify where in the manufacturing process the defect originated.
IPC’s three-week course, PCB Troubleshooting and Defect Analysis, starts September 13.
After completing the course, students will be able to diagnose the root cause and prescribe corrective action for:
- PCB defects such as interconnect separation, delamination, wedge voids, plating folds and more
- Electrodeposition defects like mouse bites, pitting and domed or crown plating
- Solderability and assembly related issues such as outgassing, black pad, creep corrosion and blow holes
We’re also offering this course at a more convenient time for our European colleagues starting October 26.
