3D SPI from Vi TECHNOLOGY at ENOVA Lyon
Saint-Egrève, France, February 2018 — Vi TECHNOLOGY, a provider of 3D inspection solutions for PCB assembly, today announced plans to exhibit at ENOVA France, scheduled to take place Feb. 7-8, 2018 at the Centre des congrès de Lyon, Cité internationale in Lyon, France. The company will showcase the PI 3D SPI system and Sigma Line module in Booth B28 with its agent eXelsius.
The awarded PI Series 3D SPI offers new horizons with programming-free software and unprecedented accuracy for small pads. The PI Series offers the only inspection systems that program automatically. The series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. With 360° Moiré technology, the PI Series offers a unique extra-large 3D image for unprecedented review interface and outstanding accuracy.
Vi TECHNOLOGY’s Sigma Line module offers a real-time combination of 3D SPI and 3D AOI inspection measurements. By considering all inspection systems as one tool, the results is a new way to optimize the SMT process and converge to the zero defect line. Also, it is the prerequisite to transform large volumes of data into actionable data.