Nordson SELECT to Showcase Flexible Selective Soldering Modularity at 2018 APEX
Individual or multiple selective soldering modules can be easily reconfigured in less than one hour for the ultimate in manufacturing flexibility
Spokane Valley, WA, USA – January 2018 – Nordson SELECT, a Nordson company (NASDAQ: NDSN), will showcase its flexible selective soldering modularity in Booth #2108 at the 2018 IPC APEX EXPO, scheduled to take place February 27-March 1, 2018 at the San Diego Convention Center.
Several Nordson SELECT models can be paired with our In-Line Flux and Preheat Module to provide a highly flexible selective soldering line for the ultimate in manufacturing flexibility. Individual or multiple solder modules can be easily reconfigured in under one hour providing increased production flexibility and the ability to rapidly adapt to changes in production requirements. This increased production flexibility via rapid line reconfiguration is further enhanced with interchangeable solder pots equipped with either single selective nozzles, dual selective nozzles or wave soldering nozzles.
Nordson SELECT models equipped with SWAK-OS 4.0 software use a single user interface for global deployment allowing worldwide program mobility across multiple machine platforms. Programs created at one customer location can be utilized at other global manufacturing sites enabling rapid reconfiguration of selective soldering lines for enhanced manufacturing flexibility. This unique capability provides Nordson SELECT customers with the ability to quickly adjust to unforeseen or unplanned changes in production requirements.
Also on exhibit will be Nordson SELECT’s unique automatic solder nozzle tinning system. As industry experts we know that only a clean and oxidation free solder nozzle can be properly wetted. Unlike other nozzle cleaning systems, Nordson SELECT’s patent pending system does not spray a liquid or powdered flux. Our solder nozzle tinning system keeps our solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the nozzle without any resulting overspray or contamination on the printed circuit board or the selective soldering machine.